Tungsten-copper composite material

1, high-performance materials for aerospace materials with high density tungsten copper, transpiration cooling performance, high temperature strength and resistance to erosion ablation performance in the aerospace industry as a missile, rocket nozzle throat insert, gas rudder assembly, air rudder, hoods and weight and so on. 2, the vacuum contact material contact material must have very good machining properties and thermal shock resistance, when breaking the contact and arcing, contact material in a few tenths of time temperatures thousands of degrees Celsius. I produced the W-Cu contact material due to its excellent physical properties and is widely used. Advantages: High ablation resistance, high toughness, good electrical conductivity, thermal conductivity. Good machining performance. 3, EDM electrode EDM carbide products in use, due to the particularity makes WC copper or graphite electrode wear quite fast, for this material EDM, the company's production of W-Cu electrodes are most suitable. Product properties: corrosion, high speed, low loss rate, the exact shape of the electrode, excellent processing performance, WC workpiece surface quality. 4, electronic packaging materials W-Cu electronic packaging materials, with both tungsten low expansion properties, but also with copper's high thermal conductivity, it is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be adjusted by the material composition and be designed, thus giving the application of the material brought great convenience. We use high-quality high-purity raw materials, molding, high temperature sintering and infiltration, got excellent performance of the W-Cu electronic packaging materials and heat sink material. For materials with high-power device package, such as a substrate, a lower electrode and the like; performance of the lead frame; military and civilian thermal control device such as thermal control board and the heatsink. Advantages: a matrix that matches the type of thermal expansion coefficient and the high thermal conductivity; excellent high temperature stability and uniformity; excellent processing properties;